Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under...
Reexamination Certificate
2006-09-05
2006-09-05
Heckenberg, Donald (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Female mold and charger to supply fluent stock under...
C425S810000
Reexamination Certificate
active
07101171
ABSTRACT:
A resin ring51is press-fitted into a grove portion formed in an inner periphery surface of an interlocking ring4. The resin ring51is made of a hard resin such as Teflon. The resin ring51as a low frictional lubricative member is interposed between the interlock ring4and an outer periphery ring3. In addition, a cavity6as a closed space is formed between a stamper1bas a molding surface of a fixed side mirror1and a mirror side molding surface2bof a moving side mirror2. While the moving side mirror2is being press-contracted to the fixed side mirror1, when a resin material is filled into the cavity6, the outer periphery ring3is slidably held in a groove of the moving side mirror2with predetermined clearances. In the interlock ring4, a plurality of openings4awhich relieve gas produced by the disc resin material filled into the cavity6are formed.
REFERENCES:
patent: 6238197 (2001-05-01), Van Hout et al.
patent: 6464487 (2002-10-01), Gabriel
patent: 08-118431 (1996-05-01), None
patent: 09-131769 (1997-05-01), None
patent: 61-95915 (1986-05-01), None
patent: 61-95919 (1986-05-01), None
patent: 3-7316 (1991-01-01), None
patent: 7-80844 (1995-03-01), None
patent: 7-130010 (1995-05-01), None
patent: 8-229990 (1996-09-01), None
patent: 8-281661 (1996-10-01), None
patent: 2000-48416 (2000-02-01), None
patent: 2000-218657 (2000-08-01), None
patent: 2001-79896 (2001-03-01), None
patent: WO 99/37471 (1999-07-01), None
Computer translation of JP 07-080844.
Computer translation of JP 2000-048416.
Supplementary EPO Search Report dated May 17, 2004.
International Search Report, dated Jul. 29, 2002.
Kishi Shinsuke
Matsuura Osamu
Miura Kazuhiro
Yoshimura Hideaki
Heckenberg Donald
Rader & Fishman & Grauer, PLLC
Sony Disc & Digital Solutions Inc.
LandOfFree
Molding die for disc substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molding die for disc substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding die for disc substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3596990