Molding die for disc substrate

Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S810000

Reexamination Certificate

active

07101171

ABSTRACT:
A resin ring51is press-fitted into a grove portion formed in an inner periphery surface of an interlocking ring4. The resin ring51is made of a hard resin such as Teflon. The resin ring51as a low frictional lubricative member is interposed between the interlock ring4and an outer periphery ring3. In addition, a cavity6as a closed space is formed between a stamper1bas a molding surface of a fixed side mirror1and a mirror side molding surface2bof a moving side mirror2. While the moving side mirror2is being press-contracted to the fixed side mirror1, when a resin material is filled into the cavity6, the outer periphery ring3is slidably held in a groove of the moving side mirror2with predetermined clearances. In the interlock ring4, a plurality of openings4awhich relieve gas produced by the disc resin material filled into the cavity6are formed.

REFERENCES:
patent: 6238197 (2001-05-01), Van Hout et al.
patent: 6464487 (2002-10-01), Gabriel
patent: 08-118431 (1996-05-01), None
patent: 09-131769 (1997-05-01), None
patent: 61-95915 (1986-05-01), None
patent: 61-95919 (1986-05-01), None
patent: 3-7316 (1991-01-01), None
patent: 7-80844 (1995-03-01), None
patent: 7-130010 (1995-05-01), None
patent: 8-229990 (1996-09-01), None
patent: 8-281661 (1996-10-01), None
patent: 2000-48416 (2000-02-01), None
patent: 2000-218657 (2000-08-01), None
patent: 2001-79896 (2001-03-01), None
patent: WO 99/37471 (1999-07-01), None
Computer translation of JP 07-080844.
Computer translation of JP 2000-048416.
Supplementary EPO Search Report dated May 17, 2004.
International Search Report, dated Jul. 29, 2002.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Molding die for disc substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding die for disc substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding die for disc substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3596990

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.