Molding die apparatus, method for disc substrate, and...

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Reexamination Certificate

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C428S066700, C428S848600, C369S280000

Reexamination Certificate

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11504140

ABSTRACT:
Preventing a molded disc substrate from generating a separation pattern. To this end, a molding die1includes a pair of stationary die6and movable die7, and an outer circumference ring16for molding an outer circumference end of the disc substrate2. The outer circumference ring16is so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable die7toward the stationary die6, and has a retaining surface39for retaining the outer circumference of the molded disc substrate2.

REFERENCES:
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patent: 4897228 (1990-01-01), Miwa et al.
patent: 5018962 (1991-05-01), Kitamura et al.
patent: 5171585 (1992-12-01), Onisawa et al.
patent: 5427520 (1995-06-01), Shimizu et al.
patent: 6495232 (2002-12-01), Weber
patent: 0 338 906 (1989-10-01), None
patent: 08-90613 (1996-04-01), None
patent: 09-123229 (1997-05-01), None
Patent Abstracts of Japan, vol. 1997, No. 9, Sep. 30, 1997 and JP 09 123229 A (Sony Corp.), May 13, 1997.
Patent Abstracts of Japan, vol. 1996, No. 08, Aug. 30, 1996 and JP 08 090613 A (Taiyo Yuden Co. Ltd), Apr. 9, 1996.
Computer Translation of Japanese Pub. No. 09-123999.

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