Molding die and molding method

Details Molding die and molding method Molding die and molding method

2006-02-28

2006-02-28

Heckenberg, Donald (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Female mold and charger to supply fluent stock under...

With means to heat or cool

C425S552000, C425S810000, C425SDIG013

Reexamination Certificate

active

07004747

ABSTRACT:
The transfer plate is energized and heated uniformly in the state in which the transfer plate heated through the electric resistance heating is separated slightly from the specular surface of the specular plate, then, immediately before the die is closed, the transfer plate is pressed against the specular surface to adhere thereto and, at the same time, the resin material is supplied to the cavity quickly and, after that, at the same time as the molded product is shaped completely, the transfer plate is de-energized so that the resin material in the cavity is quenched at the controlled temperature of the specular plate that is set to be lower than the heating temperature of the transfer plate.

REFERENCES:
patent: 4208574 (1980-06-01), Schafer
patent: 2002/0058084 (2002-05-01), Sandstrom et al.
Abstract of Japan; Publication of JP 08-090624; Applicant: Meiki Co., Ltd; Inventor: Shimojo Shunichi; Publication Date: Apr. 9, 1996.
Abstract of Japan; Publication of JP 08-132498; Applicant: Ricoh Co., Ltd; Inventor: Sudo Katsunori et al.; Publication Date May 28, 1996.
Abstract of Japan: Publication of JP 10-034655; Applicant: Taiho Kogyo KK; Inventor: Kimoto Hidetoshi; Publication Date Feb. 10, 1998.
Abstract of Japan, Publication of JP 10-315257; Applicant. Meiki Co., Ltd. Inventor: Ogawa Akihiko; Publication Date: Dec. 2, 1998.
Abstract of Japan: Publication of JP 2001-315202: Applicant: Meiki Co.. Ltd: Inventor: Ogawa Akihiko: Publication Date: Nov. 13, 2001.

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