Molding device for sealing semiconductor element with resin

Details Molding device for sealing semiconductor element with resin Molding device for sealing semiconductor element with resin

1991-01-15

1992-06-23

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

264 401, 26427217, 425121, 425125, 4251261, 425150, 425171, 425544, B29C 4502, B29C 4514

Patent

active

051238233

ABSTRACT:
A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.

REFERENCES:
patent: 3973888 (1976-08-01), Hehl

Affiliated with

Also associated with

Rating

Molding device for sealing semiconductor element with resin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding device for sealing semiconductor element with resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding device for sealing semiconductor element with resin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-929503