Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1994-07-28
1996-05-28
Michl, Paul R.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523511, 523514, 523516, 523527, 523222, 523223, 524445, 524447, C08K 334
Patent
active
055212328
ABSTRACT:
The invention is a molding composition and molding process for use in the manufacture of lightweight composite vehicle parts and construction parts having smooth surfaces. The molding process may be at low pressures. The composition includes kaolin clay filler and, optionally, hydrophilic fumed silica thixotrope.
REFERENCES:
patent: Re31975 (1985-08-01), Comstock et al.
patent: 2757160 (1956-07-01), Anderson
patent: 3290164 (1966-12-01), Ferrigno
patent: 4374215 (1983-02-01), Atkins
patent: 4421894 (1983-12-01), O'Connor et al.
patent: 4478970 (1984-10-01), Abolins et al.
patent: 4876296 (1989-10-01), Miller et al.
patent: 4997703 (1991-03-01), Gehrig
patent: 5100935 (1992-03-01), Iseler et al.
patent: 5236976 (1993-08-01), Michaels
patent: 5244958 (1993-09-01), Goodman
patent: 5246983 (1993-09-01), Shibata et al.
patent: 5281634 (1994-01-01), Hesse et al.
patent: 5319003 (1994-06-01), Gomez et al.
Engelhard T1-1006 EC3336 Jun. 1986 Specialty Aluminum Silicates Side 6.
Technology of Bakelite Low Profile FRP Molding F46568, K. E. Atkins, See p. 1 last paragraph.
Gynn Gilbert M.
Hearn David W.
Ashland Inc.
Asinovsky Olga
Michl Paul R.
PIcken Mary E.
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