Molding composition and method, and molded article

Details Molding composition and method, and molded article Molding composition and method, and molded article

2008-05-27

2008-05-27

McClendon, Sanza L. (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S025000, C522S028000, C522S030000, C522S031000, C522S066000, C522S071000, C522S074000, C522S077000, C522S079000, C522S081000, C522S083000, C522S168000, C522S170000, C522S178000, C522S181000, C525S396000, C525S340000, C428S413000, C427S493000, C264S272130, C264S272170, C264S331120, C264S331140, C264S272110

Reexamination Certificate

active

07378455

ABSTRACT:
A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

REFERENCES:
patent: 3306874 (1967-02-01), Hay
patent: 3306875 (1967-02-01), Hay
patent: 3375228 (1968-03-01), Holoch et al.
patent: 3496236 (1970-02-01), Cooper et al.
patent: 4140675 (1979-02-01), White
patent: 4165422 (1979-08-01), White
patent: 4234706 (1980-11-01), White
patent: 4329306 (1982-05-01), Crivello
patent: 4521584 (1985-06-01), Heitz et al.
patent: 4562243 (1985-12-01), Percec
patent: 4593052 (1986-06-01), Irving
patent: 4623558 (1986-11-01), Lin
patent: 4634742 (1987-01-01), Percec
patent: 4663402 (1987-05-01), Perced et al.
patent: 4665137 (1987-05-01), Percec
patent: 4677185 (1987-06-01), Heitz et al.
patent: 4701514 (1987-10-01), Percec
patent: H521 (1988-09-01), Fan
patent: 4806601 (1989-02-01), Percec
patent: 4842800 (1989-06-01), Walles et al.
patent: 4845159 (1989-07-01), Chao
patent: 4882201 (1989-11-01), Crivello et al.
patent: 4912171 (1990-03-01), Grootaert et al.
patent: 4912172 (1990-03-01), Hallgren et al.
patent: 4920164 (1990-04-01), Sasaki et al.
patent: 4923932 (1990-05-01), Katayose et al.
patent: 5001010 (1991-03-01), Chao et al.
patent: 5015675 (1991-05-01), Walles et al.
patent: 5021543 (1991-06-01), Mayska et al.
patent: 5064882 (1991-11-01), Walles et al.
patent: 5071922 (1991-12-01), Nelissen et al.
patent: 5079268 (1992-01-01), Nelissen et al.
patent: 5082686 (1992-01-01), Desorcie et al.
patent: 5091480 (1992-02-01), Percec
patent: 5162433 (1992-11-01), Nishio et al.
patent: 5213886 (1993-05-01), Chao et al.
patent: 5290883 (1994-03-01), Hosokawa et al.
patent: 5314984 (1994-05-01), Markovitz et al.
patent: 5547713 (1996-08-01), Alvarado
patent: 5610443 (1997-03-01), Inagaki et al.
patent: 5618891 (1997-04-01), Markovitz
patent: 5834565 (1998-11-01), Tracy et al.
patent: 5863970 (1999-01-01), Ghoshal et al.
patent: 5877229 (1999-03-01), Janke et al.
patent: 5880221 (1999-03-01), Liska et al.
patent: 5965663 (1999-10-01), Hayase
patent: 6051662 (2000-04-01), Tracy et al.
patent: 6096821 (2000-08-01), Adedeji et al.
patent: 6197898 (2001-03-01), van den Berg et al.
patent: 6204304 (2001-03-01), Houlihan et al.
patent: 6232362 (2001-05-01), Agars et al.
patent: 6235807 (2001-05-01), Misev
patent: 6307010 (2001-10-01), Braat et al.
patent: 6333064 (2001-12-01), Gan
patent: 6352782 (2002-03-01), Yeager et al.
patent: 6384176 (2002-05-01), Braat et al.
patent: 6387990 (2002-05-01), Yeager
patent: 6420450 (2002-07-01), Dengler et al.
patent: 6437090 (2002-08-01), Murai et al.
patent: 6469124 (2002-10-01), Braat et al.
patent: 6498200 (2002-12-01), Suzuki et al.
patent: 6518362 (2003-02-01), Clough et al.
patent: 6569982 (2003-05-01), Hwang et al.
patent: 6576700 (2003-06-01), Patel
patent: 6576718 (2003-06-01), Yeager et al.
patent: 6617398 (2003-09-01), Yeager et al.
patent: 6617400 (2003-09-01), Yeager et al.
patent: 6627704 (2003-09-01), Yeager et al.
patent: 6627708 (2003-09-01), Braat et al.
patent: 6632892 (2003-10-01), Rubinsztajn et al.
patent: 6689920 (2004-02-01), Ishii et al.
patent: 6770460 (2004-08-01), Palazzotto et al.
patent: 6774160 (2004-08-01), Yeager
patent: 6784260 (2004-08-01), Yeager et al.
patent: 6787605 (2004-09-01), Clough et al.
patent: 6787633 (2004-09-01), Peemans et al.
patent: 6794481 (2004-09-01), Amagai et al.
patent: 6800373 (2004-10-01), Gorczyca
patent: 6812276 (2004-11-01), Yeager
patent: 6835785 (2004-12-01), Ishii et al.
patent: 6841629 (2005-01-01), Maeda et al.
patent: 6878632 (2005-04-01), Nogami et al.
patent: 6878783 (2005-04-01), Yeager et al.
patent: 6897282 (2005-05-01), Freshour et al.
patent: 7067595 (2006-06-01), Zarnoch et al.
patent: 2002/0077447 (2002-06-01), Hwang et al.
patent: 2003/0018131 (2003-01-01), Davis et al.
patent: 2003/0212230 (2003-11-01), Rubinsztajn et al.
patent: 2003/0215588 (2003-11-01), Yeager et al.
patent: 2004/0146692 (2004-07-01), Inoue et al.
patent: 2004/0147715 (2004-07-01), Ishii et al.
patent: 2004/0166241 (2004-08-01), Gallo et al.
patent: 2004/0214004 (2004-10-01), Amagai et al.
patent: 2004/0225082 (2004-11-01), Mutsumi et al.
patent: 2004/0258852 (2004-12-01), Ohno et al.
patent: 2004/0265595 (2004-12-01), Tetsuji
patent: 2005/0004246 (2005-01-01), Palazzotto et al.
patent: 2005/0070685 (2005-03-01), Akira et al.
patent: 2005/0075462 (2005-04-01), Zarnoch et al.
patent: 2005/0181214 (2005-08-01), Campbell et al.
patent: 2006/0160982 (2006-07-01), Ishii et al.
patent: 2007/0004871 (2007-01-01), Lu et al.
patent: 1 37 545 (1987-07-01), None
patent: 0 492 959 (1992-07-01), None
patent: 0 261 574 (1992-11-01), None
patent: 1630199 (2006-03-01), None
patent: WO 03/072628 (2003-09-01), None
JP1997202850A; Aug. 5, 1997; “Epoxy Resin Composition for Sealing Use, Semiconductor Device Using the Same, and Production of the Composition”; Machine Translation (21 pages).
JP1997202851A; Aug. 5, 1997; “Epoxy Resin Composition for Sealing Use, Semiconductor Device Using the Same, and Production of the Composition”; Machine Translation (23 pages).
JP1998265553A; Oct. 6, 1998; “Epoxy Resin Composition for Sealing Material and Semiconductor Device”; Machine Translation (21 pages).
JP2003313290A; Nov. 6, 2003; “Process for Depositing Low-Molecular Weight Polyphenylene Ether”; Machine Translation (12 pages).
JP2003313291A; Nov. 6, 2003; “Process for Producing Expoxidized Polyphenylene Ether”; Machine Translation (17 pages).
JP2004115619A; Apr. 15, 2004; “Method for Producing Bifunctional Phenylene Ether”; Machine Translation (17 pages).
JP3525745B2; May 10, 2004; “Epoxy Resin Composition and Electric Insulating Substrate Made from the Same”; Machine Translation (15 pages).
JP3570146B2; Sep. 29, 2004; “Epoxy Resin Compositions and Adhesive Sheets and Heat-Resistant Laminates Therefrom”; Machine Translation (17 pages).
JP3570148B2; Sep. 29, 2004; “Epoxy Resin Compositions and Their Uses in Prepregs and Laminates”; Machine Translation (21 pages).
JP2004256717A; Sep. 16, 2004; “Oligomer-Modified Epoxy Resin, Its Composition, and Printed Wiring Board Using the Composition”; Machine Translation (38 pages).
JP2004307554A; Nov. 4, 2004; “Continuous Manufacture of Low-Molecular Weight Poly(Phenylene Ethers)”; Machine Translation (31 pages).
JP2004315725A; Nov. 11, 2004; “Fireproofing Polyphenylene Ether Resin Composition and Pregreg, Metallic Laminate, and Printed Circuit Board Prepared Thereby”; Machine Translation (15 pages).
JP2004331958A; Nov. 25, 2004; “Cured Products of Epoxy Resin Compositions Containing Epoxidized Poly(Phenylene Ethers) for Electronic Materials”; Machine Translation (22 pages).
JP2005023201A; Jan. 27, 2005; “Production Method of Bifunctional Phenylene Ether Oligomer”; Mach

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