Molding assembly for wafer scale molding of protective caps

Details Molding assembly for wafer scale molding of protective caps Molding assembly for wafer scale molding of protective caps

2006-03-21

2006-03-21

Heckenberg, Donald (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Preform reshaping or resizing means: or vulcanizing means...

Coacting shaping surfaces

C425S174400, C425S444000

Reexamination Certificate

active

07014451

ABSTRACT:
A mold assembly (100) formed of a pair of molds (102, 104) and a pair of release plates (118, 120). The molds (102, 104) have holes (126) which extend from outer surfaces into the mold cavities (106). The release plates (118, 120) have pins (122, 124) which pass into the holes (126, 128). When molding is finished, the molds (102, 104) are moved toward the release plates (118, 120). The pins (122, 124) contact the molded article(s) (134) and hold them in position as the molds (102, 104) are withdrawn.

REFERENCES:
patent: 5156754 (1992-10-01), Nomura et al.
patent: 6135756 (2000-10-01), Arends
patent: 0730520 (2001-05-01), None

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