Molding apparatus for sealing semiconductor devices including a

Details Molding apparatus for sealing semiconductor devices including a Molding apparatus for sealing semiconductor devices including a

1988-10-12

1991-01-08

Chiesa, Richard L.

Plastic article or earthenware shaping or treating: apparatus

With separate apparatus cleaning means

Coacting with forming means or dough divider type trap chamber

264 39, 425229, 425231, B29C 4502, B29C 4517

Patent

active

049831151

ABSTRACT:
A molding apparatus has a fixed upper platen and a movable lower platen on which are secured an upper and a lower mold half, respectively. A cleaning device for cleaning the mold surfaces of the mold halves is installed on the upper platen, and the lower platen is open so that foreign matter will not accumulate atop it.

REFERENCES:
patent: 3086431 (1963-04-01), Perry, Jr.
patent: 3479678 (1968-11-01), Jeffreys
patent: 3690801 (1972-09-01), Hutz et al.
patent: 3801251 (1974-04-01), Coscia
patent: 3941537 (1976-03-01), Abraham
patent: 4615184 (1986-12-01), Tassoni
patent: 4626184 (1986-12-01), Hammond

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