Molding apparatus for manufacturing semiconductor device

Details Molding apparatus for manufacturing semiconductor device Molding apparatus for manufacturing semiconductor device

2007-04-16

2009-11-24

Davis, Robert B (Department: 1791)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

C425S089000, C425S127000

Reexamination Certificate

active

07621732

ABSTRACT:
A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate faces the cavity, wherein the lower half includes a projecting part which has a top surface which faces the cavity and which projects from the bottom surface of the lower half toward a substantial center point of the substrate mounting plate, wherein the substrate mounting plate is adjustably mounted on the upper half and movable toward the lower half, and wherein the upper half includes a clamp mounted thereon which surrounds the projecting part when the upper and lower halves are coupled with each other.

REFERENCES:
patent: 3514849 (1970-06-01), Landron, Jr.
patent: 5424250 (1995-06-01), Sawada
patent: 5622873 (1997-04-01), Kim et al.
patent: 5644169 (1997-07-01), Chun
patent: 5897338 (1999-04-01), Kaldenberg
patent: 6489178 (2002-12-01), Coyle et al.
patent: 6558600 (2003-05-01), Williams et al.
patent: 6563207 (2003-05-01), Shinma
patent: 2004/0104478 (2004-06-01), Noguchi
patent: 2005/0026418 (2005-02-01), Egawa et al.
patent: 2005/0054144 (2005-03-01), Raben
patent: 2001-185568 (2001-07-01), None

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