Molding apparatus for encapsulating a part

Details Molding apparatus for encapsulating a part Molding apparatus for encapsulating a part

1997-07-22

2000-09-26

Ortiz, Angela

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

425576, 4251291, 425162, B29C 3326, B29C 3312

Patent

active

061235350

ABSTRACT:
A molding apparatus and method of use thereof. The molding apparatus has a stationary mold base, and at least one moveable mold core rotatable into and out of a facing relationship with the stationary mold base. When the moveable mold core is in its closed position, it cooperates with the stationary mold base to define a mold cavity. The mold base may be shaped so as to aid in forming a part, or to hold a sheet of material onto which molding material is to be deposited so as to encapsulate the part on one or more edges or surface regions. Structure may also be encapsulated onto the surface of the material during the molding operation.

REFERENCES:
patent: 2622274 (1952-12-01), Soderquist
patent: 3381340 (1968-05-01), Chapin, Jr.
patent: 3407443 (1968-10-01), Beebee et al.
patent: 3577591 (1971-05-01), Ricards
patent: 3915617 (1975-10-01), Saladin
patent: 4269587 (1981-05-01), Tranter
patent: 4354819 (1982-10-01), Wirz
patent: 4363191 (1982-12-01), Morgan
patent: 4396221 (1983-08-01), Morgan et al.
patent: 4561625 (1985-12-01), Weaver
patent: 4584155 (1986-04-01), Zanella
patent: 4688752 (1987-08-01), Barteck et al.
patent: 4762481 (1988-08-01), Weaver
patent: 4777699 (1988-10-01), Hill et al.
patent: 4858988 (1989-08-01), Morgan et al.
patent: 5061429 (1991-10-01), Yoshihara et al.
patent: 5116556 (1992-05-01), Danton
patent: 5154028 (1992-10-01), Hill et al.
patent: 5158638 (1992-10-01), Osanami et al.
patent: 5273416 (1993-12-01), Heyn et al.
patent: 5456874 (1995-10-01), Cordes et al.
patent: 5464575 (1995-11-01), Jaffiol et al.
patent: 5529476 (1996-06-01), Borasio et al.
patent: 5584526 (1996-12-01), Soldner

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