Plastic and nonmetallic article shaping or treating: processes – With step of making mold or mold shaping – per se
Reexamination Certificate
2007-07-23
2010-10-19
Del Sole, Joseph S (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
With step of making mold or mold shaping, per se
C264S313000, C264S314000
Reexamination Certificate
active
07815834
ABSTRACT:
An apparatus and method for making a mold or mold face includes a container having at least one opening. The apparatus also includes a flexible membrane that is retained to the container that extends across the opening of the container. The apparatus for making a mold further includes support media that is disposed within the container along with a vacuum valve that is connected to the container.
REFERENCES:
patent: 2488922 (1949-11-01), Mead
patent: 2513785 (1950-07-01), Browne
patent: 2517902 (1950-08-01), Luebkeman
patent: 2581489 (1952-01-01), Kilham
patent: 2770823 (1956-11-01), Kamborian
patent: 3620286 (1971-11-01), Hofmann
patent: 3883287 (1975-05-01), Grawey et al.
patent: 4160003 (1979-07-01), Kozuka et al.
patent: 4599062 (1986-07-01), Konishi
patent: 4860815 (1989-08-01), Parker et al.
patent: 4931242 (1990-06-01), Uchimura et al.
patent: 4943398 (1990-07-01), Endo et al.
patent: 5262121 (1993-11-01), Goodno
patent: 6398992 (2002-06-01), Jacobson
patent: 2005/0211870 (2005-09-01), Browne et al.
patent: 2006/0137424 (2006-06-01), Browne et al.
Leslie S. Blake, Civil Engineer's Reference Book, 4thedition, Section 37.5.5, 1989, pp. 37/19-37/20, Elsevier.
Gideon David E.
Jackson Eugene A.
Kuntz Michael
Vaughan David A.
Younie Mark L.
Del Sole Joseph S
Sanders James
The Boeing Company
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