Plastic article or earthenware shaping or treating: apparatus – Preform reshaping or resizing means: or vulcanizing means... – By fluid pressure actuated flexible diaphragm
Reexamination Certificate
2007-09-11
2007-09-11
Davis, Robert B. (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Preform reshaping or resizing means: or vulcanizing means...
By fluid pressure actuated flexible diaphragm
C425S405100, C425S456000, C425S470000
Reexamination Certificate
active
10705873
ABSTRACT:
An apparatus and method for making a mold or mold face includes a container having at least one opening. The apparatus also includes a flexible membrane that is retained to the container that extends across the opening of the container. The apparatus for making a mold further includes support media that is disposed within the container along with a vacuum valve that is connected to the container.
REFERENCES:
patent: 2488922 (1949-11-01), Mead
patent: 2513785 (1950-07-01), Browne
patent: 2581489 (1952-01-01), Kilham
patent: 2770823 (1956-11-01), Kamborian
patent: 3620286 (1971-11-01), Hofmann et al.
patent: 3883287 (1975-05-01), Grawey et al.
patent: 4160003 (1979-07-01), Kozuka et al.
patent: 4599062 (1986-07-01), Konishi
patent: 4931242 (1990-06-01), Uchimura et al.
patent: 4943398 (1990-07-01), Endo et al.
patent: 5262121 (1993-11-01), Goodno
patent: 2005/0211870 (2005-09-01), Browne et al.
patent: 2006/0137424 (2006-06-01), Browne et al.
Blake, Civil Engineer's Reference Book, 4th edition, Elsevier, Section 37.5.5, 1989.
Gideon David E.
Jackson Eugene A.
Kuntz Michael
Vaughan David A.
Younie Mark L.
Baker & Hostetler LLP
Davis Robert B.
The Boeing Company
LandOfFree
Molding apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molding apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding apparatus and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3756356