Molding apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Indefinite or running length flexible strand – rod – tube – or...

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Details

156180, 156245, 156433, 425185, 425192R, B32B 2704, B29C 3322

Patent

active

051164507

ABSTRACT:
A molding apparatus and method are provided which are of the type which utilize a die set comprising at least one die which defines at least one mold cavity for receiving resin impregnated fibers therethrough. Any one die of the die set comprises first and second mold base sections which are positionable with respect to one another so as to form a mold base which defines a channel therethrough. A mold insert defines a mold cavity completely therethrough and is adapted to be removably mounted in the channel. The die set is removably clamped between first and second clamp members so as to enable easy and convenient addition or removal of dies to or from the die set if desired.

REFERENCES:
patent: 2741294 (1956-04-01), Pancherz
patent: 2751320 (1956-06-01), Jacobs et al.
patent: 2871911 (1959-02-01), Goldsworthy et al.
patent: 2894625 (1959-07-01), Harris et al.
patent: 3374132 (1968-03-01), Boggs
patent: 4202522 (1980-05-01), Hanas et al.
patent: 4318762 (1982-03-01), Meyer
patent: 4354817 (1982-10-01), Gilman
patent: 4416604 (1983-11-01), Bender et al.
patent: 4525131 (1985-06-01), Hauser
patent: 4551087 (1985-11-01), Pan et al.
patent: 4621996 (1986-11-01), Hundley, III
patent: 4653995 (1987-03-01), Ward
patent: 4680224 (1987-07-01), O'Connor
patent: 4681722 (1987-07-01), Carter et al.
patent: 4684101 (1987-08-01), Wagner et al.
patent: 4708615 (1987-11-01), Bethea et al.
patent: 4714421 (1987-12-01), D'Agostino
patent: 4810182 (1989-03-01), Groll
patent: 4820366 (1989-04-01), Beever et al.
patent: 4828479 (1989-05-01), Pleasant
patent: 4867668 (1989-09-01), Miyairi
patent: 4900499 (1990-02-01), Mills
Martin, J. D. et al., "Pultrusion," In: Dostal, C. A., ed., Engineered Materials Handbook (1987 ed.), vol. 1, pp. 533-543.

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