Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1998-09-28
2000-08-15
Graybill, David E.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438111, 438125, H01L 2158
Patent
active
061035505
ABSTRACT:
A molded electronic circuit package is described to which stabilizing tape can be attached using automatic or semi-automatic means. The stabilizing tape stabilizes the assembly for further processing operations such as dicing or attachment to a higher level package. The assembly comprises a substrate to which devices are attached. Molded caps are formed over the devices. Molded tape supports are formed at the same time as the molded caps and are located adjacent to opposite sides of the molded cap. The molded tape supports have the same height as the molded cap. The stabilizing tape can then be attached to the tops of the molded tape supports and the molded caps using automatic or semi-automatic means.
REFERENCES:
patent: 4680617 (1987-07-01), Ross
patent: 4872825 (1989-10-01), Ross
patent: 5299091 (1994-03-01), Hoshi et al.
patent: 5656549 (1997-08-01), Woosley et al.
patent: 5744084 (1998-04-01), Chia et al.
Briar John
Camenforte Raymundo M.
Ackerman Stephen B.
Graybill David E.
Prescott Larry J.
Saile George O.
ST Assembly Test Services Pte, Ltd.
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