Molded substrate stiffener with embedded capacitors

Details Molded substrate stiffener with embedded capacitors Molded substrate stiffener with embedded capacitors

2002-03-21

2004-03-23

Thai, Luan (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S724000, C257S779000, C257S772000

Reexamination Certificate

active

06710444

ABSTRACT:

BACKGROUND
1. Field
This invention relates generally to packaging of integrated circuits. More specifically, this invention relates to a stiffener for a package substrate.
2. Backgrounds and Related Art
In recent years, substrates have become increasingly fragile. In particular, thin core and coreless substrates have emerged. Such substrates improve the electrical performance of a package by reducing the lengths and distances of circuit paths and electrical connections. Substrates are typically handled during the assembly and test manufacturing process and when changes, such as chip upgrades, are made to existing systems. To enable a package to survive such handling, as well as other stresses in the use environment of the package, stiffeners often are attached to substrates.
FIG. 1
(Prior Art) illustrates a portion of an electronic package
100
. Package
100
includes a package substrate
130
, pins
140
attached to substrate
130
, land side capacitor (LSC)
120
, a die
110
, and metal stiffeners
101
. Each metal stiffener
101
typically comprises a metal piece, such as a rectangular or circular frame, that is glued to substrate
130
. Metals such as copper may be employed for stiffeners
101
. Each metal stiffener
101
has a cutout in the middle thereof to enable die
110
to pass through the frame of each metal stiffener
101
.
Substrate
130
may comprise a thin core or coreless substrate. Substrate
130
may be handled by grasping metal stiffener
101
and without grasping substrate
130
. Accordingly, metal stiffeners
101
provide mechanical stability to substrate
130
by reducing the forces applied to substrate
130
during handling of substrate
130
.
Power delivery requirements of integrated circuits are becoming increasingly demanding. For instance, in packages that include central processing unit (CPU) elements, large amounts of electrical energy are needed to initially power a CPU that has been idle. The required change in current per unit time (di/dt) associated with ramping of the current may be very high. As such, increased amounts of capacitance are typically included in a package to store energy for the ramping. Yet, a typical package has a limited amount of space in which to house capacitive elements. Such limited space may constrain power delivery performance of the package.
Therefore, what is needed is a stiffener that provides enhanced benefits to a package substrate.


REFERENCES:
patent: 6091194 (2000-07-01), Swirbel et al.
patent: 6346743 (2002-02-01), Figueroa et al.
patent: 6512182 (2003-01-01), Takeuchi et al.
patent: 2002/0033378 (2002-03-01), Hayashi et al.

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