Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate
2004-09-02
2008-09-09
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
C257S711000, C257SE31118
Reexamination Certificate
active
07423331
ABSTRACT:
A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
REFERENCES:
patent: 4710419 (1987-12-01), Gregory
patent: 4891687 (1990-01-01), Mallik et al.
patent: 5650593 (1997-07-01), McMillan et al.
patent: 5929517 (1999-07-01), Distefano et al.
patent: 5973389 (1999-10-01), Culnane et al.
patent: 6020221 (2000-02-01), Lim et al.
patent: 6279758 (2001-08-01), Wark et al.
patent: 6284569 (2001-09-01), Sheppard et al.
patent: 6303985 (2001-10-01), Larson et al.
patent: 6326544 (2001-12-01), Lake
patent: 6426565 (2002-07-01), Bhatt et al.
patent: 6440777 (2002-08-01), Cobbley et al.
patent: 6486562 (2002-11-01), Kato
patent: 6517662 (2003-02-01), Culnane et al.
patent: 6519843 (2003-02-01), Lauffer et al.
patent: 6584897 (2003-07-01), Cobbley et al.
patent: 6599365 (2003-07-01), Jiang et al.
patent: 6602740 (2003-08-01), Mitchell
patent: 6724071 (2004-04-01), Combs
Baerlocher Cary J
Cobbley Chad A
Micro)n Technology, Inc.
Trinh Hoa B
Weiss Howard
Whyte Hirschboeck Dudek SC
LandOfFree
Molded stiffener for thin substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molded stiffener for thin substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded stiffener for thin substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3987100