Molded semiconductor package

Details Molded semiconductor package Molded semiconductor package

2006-03-24

2008-08-19

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000

Reexamination Certificate

active

07414300

ABSTRACT:
A molded semiconductor package has a lead frame to which an LSI is bonded, inner lead frames located on opposing sides of the lead frame, and wires. Each wire is connected between the LSI and a corresponding one of the inner lead frames. A distance between an edge of the lead frame (or an edge of the molded semiconductor package) and an end of inner lead frame is larger than a distance between another edge of the lead frame (or another edge of the molded semiconductor package) and an edge of an inner lead frame to minimize the length of wires connected to the lead frame.

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