Molded semiconductor device using intermediate lead pattern on f

Details Molded semiconductor device using intermediate lead pattern on f Molded semiconductor device using intermediate lead pattern on f

1994-02-22

1995-02-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437214, 437219, 437220, H01L 2160

Patent

active

053937058

ABSTRACT:
A molded semiconductor device comprises a semiconductor chip mounted on an island portion, and external leads coupled with ball pumps on the semiconductor chip by means of a conductive leads patterned on a film carrier, and the conductive leads are formed from a conductive lattice pattern on the film carrier available for other molded devices by selectively cutting the conductive lattice pattern with, for example, a laser beam generator, thereby reducing the production cost.

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patent: 5205036 (1993-04-01), Yamazami
patent: 5234866 (1993-08-01), Okinaga et al.
patent: 5304843 (1994-09-01), Takubo et al.

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