Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-04-03
2007-04-03
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000
Reexamination Certificate
active
10610648
ABSTRACT:
A semiconductor chip and a wiring strip are placed on a flat side of a base sheet. The semiconductor chip has parallel first and second surfaces. Electrodes are connected to the first surface. The electrodes all terminate in the plane of the flat side of the base sheet and adhesively connected to the flat side of the base sheet. The wiring strip has one end portion connected to the second surface of the semiconductor chip and the opposite end portion terminating in the plane of the flat side of the base sheet and adhesively connected to the flat side of the base sheet. A mold resin fills gaps between the semiconductor chip, the wiring strip, and the base sheet to lock the semiconductor chip and the wiring strip. The base sheet is removed.
REFERENCES:
patent: 6025640 (2000-02-01), Yagi et al.
patent: 2001/0015486 (2001-08-01), Kobayakawa
patent: 2001/0048116 (2001-12-01), Standing et al.
patent: 2002/0056926 (2002-05-01), Jung et al.
patent: 2002/0121684 (2002-09-01), Kobayakawa
patent: 2004/0164395 (2004-08-01), Kobayakawa
patent: 58-21360 (1983-02-01), None
patent: 10-135271 (1998-05-01), None
patent: 11-251360 (1999-09-01), None
patent: 2000-114445 (2000-04-01), None
patent: 2000-277542 (2000-10-01), None
patent: 2001-68503 (2001-03-01), None
patent: 2001-308116 (2001-11-01), None
patent: 2002-110862 (2002-04-01), None
patent: 2003-68962 (2003-03-01), None
Cao Phat X.
NEC Electronics Corporation
Young & Thompson
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