Stock material or miscellaneous articles – Composite – Of wax or waxy material
Reexamination Certificate
2008-04-22
2008-04-22
Chen, Vivan (Department: 1794)
Stock material or miscellaneous articles
Composite
Of wax or waxy material
C428S492000, C428S497000, C428S532000, C264S340000, C523S124000, C523S128000
Reexamination Certificate
active
07361408
ABSTRACT:
A molded resin object including a molded substrate containing a biodegradable resin and an applied coating formed on a surface of the molded substrate is disclosed, wherein the applied coating contains a proliferation accelerating agent for accelerating proliferation of a microbe. A method of disposing of a molded resin object including a molded substrate containing a biodegradable resin, including a step of applying a coating material on a molded resin object which coating material contains a proliferation accelerating agent for accelerating proliferation of a microbe is also disclosed.
REFERENCES:
patent: 3903029 (1975-09-01), Young
patent: 4382873 (1983-05-01), Gatellier et al.
patent: 5250353 (1993-10-01), Bartholomew et al.
patent: 5378738 (1995-01-01), Deguchi et al.
patent: 5558281 (1996-09-01), Bouldin et al.
patent: 5928741 (1999-07-01), Andersen et al.
patent: 6051663 (2000-04-01), Yamamoto et al.
patent: 6190646 (2001-02-01), Tellier et al.
patent: 6251968 (2001-06-01), Schledjewski et al.
patent: 6313194 (2001-11-01), Yagi et al.
patent: 6323307 (2001-11-01), Bigg et al.
patent: 6350337 (2002-02-01), Nakamura
patent: 6350531 (2002-02-01), Sugimoto
patent: 6669771 (2003-12-01), Tokiwa et al.
patent: 6740731 (2004-05-01), Bigg et al.
patent: 6828074 (2004-12-01), Yano et al.
patent: 2003/0010508 (2003-01-01), Greiner et al.
patent: 2003/0079846 (2003-05-01), Huang
patent: 2004/0019172 (2004-01-01), Yang et al.
patent: 05-278738 (1993-10-01), None
patent: 2003-041047 (2003-02-01), None
patent: 2003-165570 (2003-06-01), None
Cyouraku Kouhei
Takahashi Hiroshi
Yamaguchi Shingo
Yui Yasushi
Chen Vivan
Fujitsu Limited
Staas & Halsey , LLP
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