Molded printed circuit board with wipe-in connector and method o

Details Molded printed circuit board with wipe-in connector and method o Molded printed circuit board with wipe-in connector and method o

1994-07-25

1997-10-14

Abrams, Neil

Metal working

Method of mechanical manufacture

Electrical device making

29848, 439 55, 439 77, H05K 300

Patent

active

056758880

ABSTRACT:
An automotive instrument cluster case is molded of a resin material. A rigid rear wall of the case has a planar outer surface including a connector region having two adjacent flaps, each flap molded with a thin flexible section and a rigid terminal section. Printed circuit paths are applied to the plane outer surface including the flaps. Then the flaps are deformed into the case, with the flexible section being curved and the terminal sections being spaced apart with the circuit paths forming terminal strips facing one another to form a connector socket. Interlocking stop elements molded on the inner surface hold the flaps apart to receive a male connector.

REFERENCES:
patent: 4798544 (1989-01-01), Hartman
patent: 5397239 (1995-03-01), Zaderej et al.

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