Molded package integrated circuit with electrochemical cell

Details Molded package integrated circuit with electrochemical cell Molded package integrated circuit with electrochemical cell

1993-08-11

1995-09-19

Donovan, Lincoln

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257678, H01L 2302

Patent

active

054517150

ABSTRACT:
A packaged integrated circuit and method of manufacturing the same is disclosed. The semiconductor integrated circuit chip is mounted and bonded to a lead frame in the conventional fashion, and an inner molded body is formed therearound. The leads of the lead frame have inner and outer dambars, with the inner dambars located so as to prevent bleedout of mold compound during the molding of the inner body. Upon removal of the inner dambars, two tie bars become floating and are then formed to extend above the inner molded body so as to make contact to an electrochemical cell that is attached to the inner molded body. An outer body is then molded to surround the inner molded body and the cell, with the outer dambars located so as to prevent bleedout of mold compound. Removal of the outer dambars and formation of the leads into the desired shape completes the assembly of the packaged integrated circuit. A molded integrated circuit package including both the integrated circuit together with a battery for backup or primary power is thus provided.

REFERENCES:
patent: 5055704 (1991-10-01), Link et al.
patent: 5124782 (1992-06-01), Hundt et al.
patent: 5153710 (1992-10-01), McCain
patent: 5187564 (1993-02-01), McCain

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