Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate
2006-03-23
2008-12-09
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
In combination with or also constituting light responsive...
C257S099000
Reexamination Certificate
active
07462870
ABSTRACT:
A molded package comprises at least a first metal member, a second metal member, and a third metal member. Each member includes an end portion inserted into a mold member where a recess is formed and another end portion protruding from an outer wall of the mold member. A portion of each main surface of the metal members is exposed from the mold member in the bottom of the recess. A portion of each main surface can be also divided into at least two bonding regions by a wall portion comprising part of the mold member. A semiconductor device of the present invention comprises the molded package, a semiconductor component, and an encapsulating member covering the semiconductor component, and has a high reliability.
REFERENCES:
patent: 3509430 (1970-04-01), Mroz
patent: 3566208 (1971-02-01), Wang
patent: 5309460 (1994-05-01), Fujimaki et al.
patent: 5335642 (1994-08-01), Hancock et al.
patent: 5367530 (1994-11-01), Noishiki et al.
patent: 5859387 (1999-01-01), Gagnon
patent: 6054716 (2000-04-01), Sonobe et al.
patent: 6084252 (2000-07-01), Isokawa et al.
patent: 6924514 (2005-08-01), Suenaga
patent: 6943433 (2005-09-01), Kamada
patent: 2004/0075100 (2004-04-01), Bogner et al.
patent: 2004/0256706 (2004-12-01), Nakashima
patent: 2005/0269591 (2005-12-01), Hsin Chen et al.
patent: 2006/0250790 (2006-11-01), Mah et al.
patent: 2006/0267042 (2006-11-01), Izuno et al.
patent: 2007/0193763 (2007-08-01), Parkhill et al.
patent: 2007/0207384 (2007-09-01), Nakura
patent: 2000-188425 (2000-07-01), None
patent: 02/084749 (2002-10-01), None
Clark S. V
Nichia Corporation
Smith Patent Office
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