Molded memory card production using carrier strip

Details Molded memory card production using carrier strip Molded memory card production using carrier strip

2007-06-26

2007-06-26

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S126000, C257SE21700

Reexamination Certificate

active

10982216

ABSTRACT:
Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the molds assembly is closed to precisely and reliably position the PCBA inside of an associated cavity during the molding process. In one embodiment, the PCB substrate is positioned in a bent arrangement to accommodate the use of inexpensive memory devices. Write-protect switches are provided.

REFERENCES:
patent: 5563769 (1996-10-01), MacGregor
patent: 5891483 (1999-04-01), Miyajima
patent: 6040622 (2000-03-01), Wallace
patent: 6102743 (2000-08-01), Haffenden et al.
patent: 6114189 (2000-09-01), Chia et al.
patent: 6166913 (2000-12-01), Fun et al.
patent: D445096 (2001-07-01), Wallace
patent: 6323064 (2001-11-01), Lee et al.
patent: D452690 (2002-01-01), Wallace et al.
patent: D452865 (2002-01-01), Wallace et al.
patent: D453934 (2002-02-01), Wallace et al.
patent: 6381143 (2002-04-01), Nakamura
patent: 6399906 (2002-06-01), Sato et al.
patent: 6410355 (2002-06-01), Wallace
patent: 6462273 (2002-10-01), Corisis et al.
patent: 6527188 (2003-03-01), Shobara et al.
patent: 6624005 (2003-09-01), DiCaprio et al.
patent: 6634561 (2003-10-01), Wallace
patent: 2002/0186549 (2002-12-01), Bolken
patent: 2004/0175866 (2004-09-01), Woerz et al.
patent: 2004/0245674 (2004-12-01), Yew et al.
patent: 2006/0220202 (2006-10-01), Osako et al.

Affiliated with

Also associated with

Rating

Molded memory card production using carrier strip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molded memory card production using carrier strip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded memory card production using carrier strip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3880562