Molded integrated circuit package incorporating thin decoupling

Details Molded integrated circuit package incorporating thin decoupling Molded integrated circuit package incorporating thin decoupling

1990-02-12

1991-01-29

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 74, 361386, H01G 114, H05K 702, H01L 2302

Patent

active

049891170

ABSTRACT:
A decoupling scheme which is particularly well suited for use with molded integrated circuit packages incorporating lead frames is presented. In accordance with the present invention, a thin decoupling capacitor is used which is comprised of a ceramic or like substrate having printed or otherwise applied thereon conductive layers, dielectric layers (e.g., glass/ceramic dielectric paste or dielectric sol-gel) and protective layers. Mounted on this thin capacitor is an integrated circuit chip. This thin capacitor/IC chip assembly is attached directly to the IC lead frame and thereafter encapsulated within the molded package resulting in a decoupling scheme which is internal to the molded IC package. Printed conductors on the thin capacitor's ceramic substrate are attached to appropriate fingers of the lead frame by welding, soldering or the like to effect strong mechanical and electrical contact.

REFERENCES:
patent: 4288841 (1981-09-01), Gogal
patent: 4734819 (1988-03-01), Hernandez et al.
patent: 4750092 (1988-06-01), Werther

Affiliated with

Also associated with

Rating

Molded integrated circuit package incorporating thin decoupling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molded integrated circuit package incorporating thin decoupling , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded integrated circuit package incorporating thin decoupling will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-818538