Molded integrated circuit package incorporating decoupling capac

Details Molded integrated circuit package incorporating decoupling capac Molded integrated circuit package incorporating decoupling capac

1990-02-12

1991-02-19

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 74, 361386, H01G 114, H05K 702, H01L 2302

Patent

active

049949365

ABSTRACT:
A decoupling capacitor is attached directly to an IC lead frame and thereafter encapsulated within a molded package along with an IC chip resulting in a decoupling scheme which is internal to the molded IC package. The capacitor preferably comprises a thin layer of ceramic dielectric sandwiched between top and bottom conductors. The top conductor may be attached to the die bar of the lead frame using an electrically non-conductive or conductive adhesive. Leads extending from the capacitors are attached to appropriate fingers of the lead frame by welding, soldering or the like to effect strong mechanical and electrical contact.

REFERENCES:
patent: 4288841 (1981-09-01), Gogal
patent: 4734819 (1988-03-01), Hernandez et al.
patent: 4750092 (1988-06-01), Werther

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