Molded hybrid IC package and lead frame therefore

Details Molded hybrid IC package and lead frame therefore Molded hybrid IC package and lead frame therefore

1990-07-05

1991-10-01

Hille, Rolf

357 72, 357 70, H01L 2348, H01L 2328

Patent

active

050538527

ABSTRACT:
The present invention is a molded Hybrid Integrated Circuit package in which a carrier substrate with a various circuit elements including an integrated circuit is supported within a resilient cradle formed by down-set and compliant portions of leads arranged in a quad configuration around the periphery of the carrier substrate, with ends of the down-set portions being secured to pads arranged on the periphery of the carrier substrate. Prior to the assembly with carrier substrate and molding of the resultant subassembly, the leads form a part of a lead frame including elongated bar and dam-bar on each of the quad sides interconnecting end and central portions, respectively, of the leads, and an interconnecting array of connecting links and bridges at the ends of the dam-bars. The lead-frame design, including the down-set and resilient portions of the leads, provides for the stress relief between the carrier substrate and the lead frame, especially during the termo-bond lead attachment and molding of an encapsulating resin around the carrier substrate and leads subassembly.

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