Molded housing with integral heatsink

Details Molded housing with integral heatsink Molded housing with integral heatsink

1998-07-02

2000-05-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361705, 361707, 361719, 361728, 361753, 257707, 257713, 165185, 165 803, 174 163, 174 524, H05K 720

Patent

active

060580135

ABSTRACT:
A plastic housing assembly is constructed with a non-plateable plastic wall portion (101), and a plateable plastic wall portion (107) positioned abutting (109) the non-plateable plastic wall portion (101). The plateable plastic wall portion (107) has a via (115) disposed therethrough for thermally coupling an outer surface (111) to an inner surface (113). A heat-generating component (119) is disposed coupled to the second inner surface (113). The via (115) is preferably plated with metal so that heat produced from the heat-generating component (119) is conducted away from the inner surface (113) to the outer surface (111).

REFERENCES:
patent: 4466483 (1984-08-01), Whitfield et al.
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 5218215 (1993-06-01), Liang et al.
patent: 5302467 (1994-04-01), Baumgartner et al.
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 5812375 (1998-09-01), Casperson

Affiliated with

Also associated with

Rating

Molded housing with integral heatsink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molded housing with integral heatsink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded housing with integral heatsink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1598914