Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1997-06-27
1999-02-16
Kincaid, Kristine
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
361816, 361752, H05K 900
Patent
active
058723323
ABSTRACT:
A metal shield is stamped from sheet metal into a box shape and tabs are bent up from the housing walls, and posts are extruded from the tabs. The shield is then insert molded into a plastic housing. A connector shroud is molded on one side of the housing and apertures for terminal pins are also formed during molding. Pins are pressed into the aperture and the ends bent up for circuit board connection. Metal bushings insert molded into ears on the housing provide mounting lugs. The tabs are supports for a circuit board and the posts extend through holes in the circuit board and are upset to retain the board without screws.
REFERENCES:
patent: 5023752 (1991-06-01), Detter et al.
patent: 5150282 (1992-09-01), Tomura et al.
patent: 5206796 (1993-04-01), Thompson et al.
patent: 5231561 (1993-07-01), Johnson et al.
patent: 5349132 (1994-09-01), Miller et al.
patent: 5375040 (1994-12-01), Cooper et al.
patent: 5392197 (1995-02-01), Cuntz et al.
patent: 5430618 (1995-07-01), Huang
patent: 5703754 (1996-02-01), Hinze
Delco Electronics Corp.
Funke Jimmy L.
Kincaid Kristine
Ngo Hung V
LandOfFree
Molded housing with EMI shield does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molded housing with EMI shield, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded housing with EMI shield will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2064216