Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Patent
1997-06-27
1998-06-30
Niebling, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Incorporating resilient component
438123, 438124, 438127, 26427217, H01L 2144, H01L 2148, H01L 2150
Patent
active
057733228
ABSTRACT:
A molded encapsulated electronic component containing a silicon device, chip, or integrated circuit characterized by ease of fabrication and minimum possibility of breakage or dislocation, included a lead frame bearing a compressed, thin elastomeric, anisotropic, electrically conductive compliant interconnect on which the silicon integrated circuit is positioned--all mounted within an all-enveloping plastic.
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Fulton et al--Applications and Reliability of the AT&T Elastomeric Conductive Polymer Interconnection System--Proceedings of the Technical Conference (1990) International Electronics Packaging Conference, Marlborough, Mass (Sep. 10-12, 1990) pp. 930-942.
Elastomeric Technologies Inc--Technical Data Sheet re: Silfil/Carfil Conductive Silicone Sheet (1 page).
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Lucent Technologies - Inc.
Niebling John
Zarneke David A.
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