Molded encapsulated electronic component

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component

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438123, 438124, 438127, 26427217, H01L 2144, H01L 2148, H01L 2150

Patent

active

057733228

ABSTRACT:
A molded encapsulated electronic component containing a silicon device, chip, or integrated circuit characterized by ease of fabrication and minimum possibility of breakage or dislocation, included a lead frame bearing a compressed, thin elastomeric, anisotropic, electrically conductive compliant interconnect on which the silicon integrated circuit is positioned--all mounted within an all-enveloping plastic.

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Fulton et al--Applications and Reliability of the AT&T Elastomeric Conductive Polymer Interconnection System--Proceedings of the Technical Conference (1990) International Electronics Packaging Conference, Marlborough, Mass (Sep. 10-12, 1990) pp. 930-942.
Elastomeric Technologies Inc--Technical Data Sheet re: Silfil/Carfil Conductive Silicone Sheet (1 page).
Elastomeric Technologies Inc--Elastomeric Selection Guide (1 page).

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