Molded electronic package and method of preparation

Details Molded electronic package and method of preparation Molded electronic package and method of preparation

1997-12-31

2000-12-12

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361762, 361763, 361779, 361807, 174 521, 174255, 174256, 174257, 174260, 439 68, 439 66, 428401, H05K 0702

Patent

active

061607142

ABSTRACT:
An improved way of preparing packaged electronic circuitry using molded plastics, ceramic Thick Film technology, and Polymer Thick Film technology. In this invention at least one of the electronic devices in the package is supported in a plastic molded substrate, and the circuit traces area added to the surface of the electronic device.

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"Guidelines for Molded Interconnection Devices" Oct. 1990; IPC Standard.

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