Molded electronic component

Details Molded electronic component Molded electronic component

1997-03-27

1998-11-24

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257686, 257667, 257787, 257798, 257693, H01L 23495

Patent

active

058411879

ABSTRACT:
A method for manufacturing an electronic component by seal-molding with resin a die pad mounted by an electronic element thereon and loads of input-and-output terminals which are supported by a lead frame having an outer frame and removing such sealed electronic component with mold materials from the outer frame of the lead frame which includes suspending pins for supporting the leads and a first mold holder disconnected from the leads, the method including the steps of resin molding a first mold member on the leads and the first mold holder to join the leads and the first mold member with the first mold member, cutting the suspending pins between the first mold member and the outer frame, resin-molding a second mold member on the first mold member to cover the cut ends of the suspending pins, and cutting the first mold holder between the second mold member and the outer frame to remove thus molded electronic component from the lead frame.

REFERENCES:
patent: 5097317 (1992-03-01), Fujimoto et al.
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5536970 (1996-07-01), Higashi et al.

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