Molded electronic circuit device

Details Molded electronic circuit device Molded electronic circuit device

1984-12-21

1987-11-17

Scott, J. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52PE, H05K 506

Patent

active

047077638

ABSTRACT:
A molded electronic circuit device including a printed circuit board having an electronic circuit in a synthetic resin, the electronic circuit including heat-radiating electronic elements such as a power transistor and contained within a case holding the printed circuit board. According to the present invention, the synthetic resin material fills the case between the electronic elements so as to conduct heat away from the electronic elements, the synthetic resin material comprising a silicon carbide or a silicon carbide compound mixed as a major constituent in an epoxy resin and having a metal oxide added to the resultant mixture.

REFERENCES:
patent: 2896135 (1959-07-01), Briggs
patent: 3390226 (1968-06-01), Beyerlein
patent: 3501582 (1970-03-01), Heidler et al.
patent: 4381518 (1983-04-01), Bahlinger
patent: 4427740 (1984-01-01), Stackhouse et al.

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