Spring devices – Vehicle – Lever and nontorsion spring
Patent
1995-01-13
1997-10-21
Saadat, Mahshid D.
Spring devices
Vehicle
Lever and nontorsion spring
257693, 257713, 257723, 257787, H01L 2348, H01L 2334, H01L 2328
Patent
active
056799764
DESCRIPTION:
BRIEF SUMMARY
INDUSTRIAL FIELD
The present invention relates to molded electric parts prepared by molding active or passive elements, such as a transistor, a diode, a resistance, and a film capacitor, with a resin for simplified packaging. The invention also pertains to a method of manufacturing such molded electric parts.
PRIOR ART
In many cases, active and passive elements are formed to chips for circuit integration. Typical examples of such active and passive elements include 3-terminal surface-packaging, molded mini-transistors having short lead wires and molded film capacitors as illustrated in the perspective view of FIG. 8. With referring to FIG. 8, a film capacitor element 102 is electrically connected to metal lead frames 127,127 via wires 128,128 bonded with solder 129, and further molded with a resin 126, so that the film capacitor element 102 is protected from outside humidity.
A method of manufacturing such a film capacitor is described according to FIGS. 9A through 9B.
At a first step, a metal frame 130 including rows of lead frames 127,127, . . . ,127 is formed by blanking as illustrated in FIGS. 9A and 9B. A film capacitor element 102 is connected to each pair of lead frames 127 by a known wire-bonding method using wires 128 and solder 129 as shown in the enlarged view of FIG. 9C. Each film capacitor element 102 connecting with the pair of lead frames 127,127 is then molded with a resin and separated from the adjacent molded film capacitors.
Although prior-art electric parts formed to chips have shortened lead Wires or lead frames, the short lead wires or lead frames still protrude from the electric elements. This makes down-sizing and weight reduction of such electric parts rather difficult. Humidity sometimes invades a clearance (126a in FIG. 8) formed between the projected lead frame and the resin mold so as to deteriorate the electric element, generate an inductance due to twisting of lead wires, or even disconnect the lead wires. Apertures which the lead wires run through are to be formed on substrates such as printed circuit boards. Precise positioning of the lead wires with respect to the apertures is required in the process of packaging since the element chips have very narrow spaces between the lead wires.
The conventionally applied wire bonding method which solders each film capacitor element to a pair of lead frames via wires with a precision robot gives problems of an extremely low production efficiency and a high equipment cost. Other drawbacks include a variation in or scatter of the floating capacity between element electrodes due to a shift of the wire bonding position or the relative position of lead frames and recycle or treatment of massive metal wastes caused by blanking and cutting lead frames.
One object of the invention is thus to provide a molded electric part which does not include any lead wires and is preferably compact in size and light in weight.
Another object of the invention is to prevent deterioration of an electric element by molding the element with a resin.
Still another object of the invention is to simultaneously manufacture a number of products having fixed dimensions and excellent electrical properties through injection molding with a multi-forming mold complex.
DISCLOSURE OF THE INVENTION
The invention is directed to a molded electric part including: an element having an electrode; an element-receiving body primarily composed of a synthetic resin with high dielectric ability, the element-receiving body having an element-receiving recess formed in a predetermined site of the element-receiving body for accommodating the element therein; a conductive pattern formed by plating a surface of the element-receiving body; and an butside-connection terminal formed on at least one face of the element-receiving body, wherein the electrode of the element is electrically connected to the outside-connection terminal via the conductive pattern.
Examples of the molded electric part according to the invention include molded film capacitors, molded transistors, molded thermis
REFERENCES:
patent: 3600650 (1971-08-01), Obenhaus
Technical Notes; RCA; Hermatically Sealed Semiconductor "Flip-Chip" Assembly; Balents. Feb. 11, 1970.
Kikuzawa Masanaga
Nishikawa Yoshiaki
Takeda Yasuyuki
Clark Jhihan B.
Polyplastics Co. Ltd.
Saadat Mahshid D.
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