Molded component, electronic apparatus, and method of...

Details Molded component, electronic apparatus, and method of... Molded component, electronic apparatus, and method of...

2009-10-15

2011-10-04

Edmonds, Lisa Lea (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C348S333010

Reexamination Certificate

active

08031462

ABSTRACT:
A molded component includes: a primary molded layer including a boxlike base portion that has a width direction in a first direction, a length direction in a second direction, and a height direction in a third direction and includes a first surface protruding in the third direction and a second surface that forms a spatial portion on the other side of the first surface, and a pedestal portion protruding outwardly in parallel to the first direction and the second direction from a circumferential edge of the base portion; a secondary molded layer formed of an optically-transparent resin material, that is laminated on the primary molded layer and has the same width and length as the primary molded layer; and an in-mold layer formed between the primary molded layer and the secondary molded layer.

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