Molded communications module having integrated plastic...

Details Molded communications module having integrated plastic... Molded communications module having integrated plastic...

2007-12-17

2011-11-15

Bui, Hung S (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S730000, C361S737000

Reexamination Certificate

active

08059415

ABSTRACT:
An embodiment disclosed herein relates to a communications module. The communications module includes a body composed of a plastic resin and a plurality of conductive traces and contact pads defined on a portion of a surface of the body. The module also includes at least one substantially vertical ridge defined on the body surface, and at least one pocket defined on the body suitable for receiving an electronic component. The communications module may also include a body composed of a plastic resin and conductive features defined on a surface of the body configured to render the communications module operable without implementing a printed circuit board as part of the body. Additional embodiments relate to systems and methods for attaching one or more optical transmit assemblies to the communications module and for electrically connecting conductive traces in a temporary fashion on the surface of the body of the communications module.

REFERENCES:
patent: 5513073 (1996-04-01), Block et al.
patent: 5535034 (1996-07-01), Taniguchi
patent: 5875047 (1999-02-01), Abe et al.
patent: 7276267 (2007-10-01), Schauz
patent: 7314318 (2008-01-01), Anderl et al.
patent: 2009/0163045 (2009-06-01), Peloza et al.
patent: 2010/0243844 (2010-09-01), Peloza et al.

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