Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits
Patent
1975-11-03
1978-03-21
Grimley, Arthur T.
Electricity: conductors and insulators
Conduits, cables or conductors
Single duct conduits
H05K 100
Patent
active
040805131
ABSTRACT:
The present invention is directed to a method of preparing a substrate to improve the adherence of a metallic coating to the substrate and the product thereof. More particularly, a method of manufactiring a molded circuit board and unique circuit board produced thereby, is disclosed. A molding compound, such as an epoxy resin is blended with a plating additive, such as calcium carbonate that is relatively inert to the molding compound. The blended mix can then be molded into a desired shape which, for a printed circuit board, can be a relatively flat plate configuration with a recessed groove and hole formation pattern. The high relief areas of the circuit board can be masked with a protective material. The plating additive can then be chemically etched from the grooved recessed area and holes, for example, by a hydrochloric acid bath. Appropriate catalyst and accelerators can be applied to the recessed groove pattern before the protective mask material is removed. In one embodiment, an electroless plating nickel material can be deposited to permit it to penetrate the interstices or cavity pattern, left in the recessed groove and hole pattern by the etching of the plating additive. Copper can then be applied to the nickel pattern in the recessed grooves, for example, by dipping the substrate in an electroless plating copper solution. The substrate is heated to cure the epoxy resin for mechanically locking the metallic coating in the interstices, or cavities, left by the etching of the plating additive.
REFERENCES:
patent: 3378434 (1968-04-01), Harrington
patent: 3514538 (1970-05-01), Chadwick et al.
patent: 3526573 (1970-09-01), Kepple et al.
patent: 3812019 (1974-05-01), Needham et al.
patent: 3836557 (1974-09-01), Knowles
patent: 3985928 (1976-10-01), Watanabe et al.
patent: 3996142 (1976-12-01), White et al.
Cuneo Edward A.
Kato Makoto
Pinkerton Aaron L.
Wilson Michael S.
Grimley Arthur T.
Jackson Harold L.
Jones Stanley R.
Metropolitan Circuits Incorporated of California
Price Joseph W.
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