Molded circuit board

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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H05K 100

Patent

active

049582607

ABSTRACT:
A molded circuit board is constructed by forming a plurality of resin moldings integrally with a circuit film including an insulating film and circuit pattern on the insulating film, spaced specified distances therebetween, on one side of the circuit film. The plurality of moldings can be assembled into an electronic device box by bending the intermediate portion, between the moldings, of the circuit film.

REFERENCES:
patent: 4085433 (1978-04-01), Baranowski
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4700880 (1987-10-01), Glover
patent: 4843520 (1989-06-01), Nakatani et al.

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