Molded circuit board

Details Molded circuit board Molded circuit board

1989-02-16

1990-04-03

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361397, 361403, 361405, 174261, H05K 100

Patent

active

049142593

ABSTRACT:
A molded circuit board formed by molding a resin substrate to one side of a circuit film made by forming a desired circuit pattern to an insulating film in a manner to form an integral body. In the circuit film, there are provided soldering pad regions for mounting surface-mounting parts in a surface of the circuit film opposite the other surface in contact with resin substrate and through-holes at locations of the circuit film where insert-mounting parts are mounted. In the resin substrate, holes for receiving insert-mounting parts are formed in the molding process at the locations corresponding to the through-holes of the circuit film.

REFERENCES:
patent: 4405971 (1983-09-01), Ohsawa
patent: 4439815 (1984-03-01), Close et al.
patent: 4584767 (1986-04-01), Gregory
patent: 4604799 (1986-08-01), Gurol
patent: 4687695 (1987-08-01), Hamby
patent: 4688328 (1987-08-01), Jebens et al.
patent: 4710419 (1987-12-01), Gregory
patent: 4758459 (1988-07-01), Mehta
patent: 4811482 (1989-03-01), Moll

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