Molded circuit board

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

Patent

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Details

428209, 428901, 174 685, 361403, 264104, 29848, B32B 310, H05K 710, C04B 3500, H01K 322

Patent

active

047584599

ABSTRACT:
A circuit board is molded of a heat resistant synthetic resin. Component mounting positions are formed at the time of molding, the mounting positions comprising formations, such as recesses or protrusions, on at least one surface. A circuit pattern is formed on at least one surface and the circuit pattern extends to and over a surface of each formation. A circuit board can be planar or non-planar and be of any desired shape, not necessarily rectangular.

REFERENCES:
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patent: 4402135 (1983-09-01), Schaeingruber et al.
patent: 4403107 (1983-09-01), Hoffman
patent: 4433009 (1984-02-01), Henze et al.
patent: 4604799 (1986-08-01), Gurol
patent: 4614837 (1986-09-01), Kane et al.
IBM Tech. Disclosure Bulletin, vol. 20, No. 7, p. 2615, Dec., 1977, McBride.
Western Electric Tech. Digest No. 15, Jul., 1969, p. 15, Mayer.
IBM Tech. Discl. Bull., vol. 1, No. 6, Apr., 1959, Kellneir, p. 18.

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