Molded chip carrier

Details Molded chip carrier Molded chip carrier

1988-02-18

1990-03-06

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29832, H01L 2302

Patent

active

049068024

ABSTRACT:
A molded chip carrier includes an integral carrier body made from a first molded section having a predetermined shape and a second molded section having a second predetermined shape. One of the first and second molded sections is made from a non-conductive material and the other section is made from a non-conductive material that is capable of receiving a deposit of conductive material. A conductive material is deposited on the outer exposed surface of the molded section capable of receiving the deposit. This particular molded section has an outer surface that defines a plurality of non-intersecting, continuous paths that form the input/output leads on the carrier body. The chip carrier includes a protective cap that can be placed over an electronic chip mounted within the carrier body.

REFERENCES:
patent: 4298769 (1981-11-01), Richman
patent: 4682270 (1987-07-01), Whitehead et al.

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