Molded case integrated circuit with a dynamic impedance reducing

Details Molded case integrated circuit with a dynamic impedance reducing Molded case integrated circuit with a dynamic impedance reducing

1991-10-28

1993-09-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174261, 257690, 361783, 361764, 361813, H05K 702

Patent

active

052434966

ABSTRACT:
A device for reducing dynamic impedances in a molded case integrated circuit comprises a chip (15) and several annular metal planes (21, 22) separated from each other by an insulating film (27, 28), each plane comprising, on its external border, legs (23, 24) coupled to the exterior of the case and, on its internal border, legs (25, 26) coupled to pads of the chip (15). The legs (23-26) are connected to the exterior and to the pads of the chip through leads (20) of a conventional connection network.

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patent: 5107325 (1992-04-01), Nakayoshi
patent: 5151771 (1992-09-01), Hirai et al.
patent: 5166866 (1992-11-01), Kim et al.
patent: 5175397 (1992-12-01), Lindberg

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