Molded carrier ring leadframe having a particular resin injectin

Details Molded carrier ring leadframe having a particular resin injectin Molded carrier ring leadframe having a particular resin injectin

1993-09-30

1996-05-14

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257670, 257669, 257667, H01L 23495, H01L 2302

Patent

active

055170560

ABSTRACT:
A leadframe (30) having a novel resin injecting area (44) is disclosed to facilitate and control the removal of a molded gate (18) prior to excising a semiconductor device(70) from a carrier ring (14). The carrier ring has a corner which is on a diagonal with a corner of the package body (12) to form the resin injecting area. The resin injecting area of the leadframe has a hole (48) and an extension bar (50) extending from the hole to connect to a tie bar (36), which supports a die pad (32), inside the package body. The hole in the leadframe is designed for retaining a molded gate. The extension bar is designed to make the removal of a portion of a molded gate easier and more controllable. The semiconductor device can be shipped in the carrier ring with a portion of the molded gate already removed.

REFERENCES:
patent: 4301464 (1981-11-01), Otsuki et al.
patent: 4400714 (1983-08-01), Brown
patent: 4868635 (1989-09-01), Frechette et al.
patent: 4897602 (1990-01-01), Lin et al.
patent: 4915607 (1990-04-01), Medders et al.
patent: 5168345 (1992-12-01), Brossart
patent: 5223738 (1993-06-01), Okada
patent: 5381037 (1995-01-01), Olivarez

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