Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1989-10-16
1991-05-14
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428409, 428419, 428457, 428458, 4284744, 4284747, 428704, 428901, 427 96, 264104, 264129, 361397, 174250, B32B 900
Patent
active
050155199
ABSTRACT:
This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after roughening of the surface of a primary molded article, and then, the molded article is inserted into the mold and a secondary article molded thereabout so that the portions to be plated with metal are exposed, and after such molding, the exposed portions are plated with metal. Alternatively, the catalyst may be applied after molding of the secondary article around the roughened primary molded article.
REFERENCES:
patent: 3259559 (1966-07-01), Schneble, Jr. et al.
patent: 3737339 (1973-06-01), Alsberg et al.
patent: 3884704 (1975-05-01), Rantell et al.
patent: 4389771 (1983-06-01), Cassidy et al.
patent: 4451505 (1984-05-01), Jans
patent: 4574031 (1986-03-01), Dorey, II et al.
patent: 4615763 (1986-10-01), Gelorme et al.
patent: 4812275 (1989-03-01), Yumoto
patent: 4908259 (1990-03-01), Yumoto
Ryan Patrick J.
Sankyo Kasei Kabushiki Kaisha
LandOfFree
Molded article with partial metal plating and a process for prod does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molded article with partial metal plating and a process for prod, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded article with partial metal plating and a process for prod will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1647453