Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-11-18
1996-01-16
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156194, 156245, 156443, 156475, 264257, 425467, 425381, B32B 3100
Patent
active
054844983
ABSTRACT:
A method of molding an elongated, tapered seamless and hollow member or tubular of net shape comprising providing an elongated, tapered mandrel, applying a composite material consisting of reinforced fibers with a resin on the mandrel, providing a shell having an elongated, tapered bore, inserting the mandrel with the composite material applied thereon into the bore of the shell to provide a mold assembly, heating the mold assembly, displacing the mandrel and shell longitudinally toward each other to compress the composite material of the article being formed by simultaneously applying a tensile force at one end of the mandrel and a compressive force at the other, allowing the mold assembly to cool, and then separating the shell and mandrel from the molded article.
REFERENCES:
patent: 2768921 (1956-10-01), Pigg
patent: 2794481 (1957-06-01), Anderson
patent: 3427689 (1969-02-01), Windecker
patent: 3896206 (1975-07-01), Beaver et al.
patent: 3974012 (1976-08-01), Hogarth
patent: 4160639 (1979-07-01), Umeda
patent: 4353964 (1982-10-01), Grimm et al.
patent: 4683099 (1987-07-01), Buxton et al.
patent: 4731216 (1988-03-01), Topolski
patent: 4849152 (1989-07-01), Rumberger
Hogarth Harold P.
Hogarth Wayne E.
Sells J.
Simmons David A.
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