Molded array integrated circuit package

Details Molded array integrated circuit package Molded array integrated circuit package

1997-09-10

2000-09-05

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, 438124, 438127, H01L 2144

Patent

active

061141895

ABSTRACT:
One aspect of the invention relates to a semiconductor substrate. In one version of the invention, a semiconductor substrate includes a package substrate having first and second surfaces with conductive traces formed thereon and structures for providing electrical connection between selected conductive traces, a die attach area on the first surface of the package substrate adapted to provide physical connection to a semiconductor die, the die attach area having conductive contacts for providing electrical connection between the die and conductive traces on the first surface, a package frame, at least one substrate strap which connects the package substrate to the package frame, the substrate strap being formed integrally with the package substrate and the package frame.

REFERENCES:
patent: 4822550 (1989-04-01), Komaths
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5557150 (1996-09-01), Variot et al.
patent: 5565709 (1996-10-01), Fukushima et al.
patent: 5661338 (1997-08-01), Yoo et al.
patent: 5731231 (1998-03-01), Miyazima
patent: 5841192 (1998-11-01), Exposito
patent: 5874784 (1999-02-01), Aoki et al.
patent: 5886398 (1999-03-01), Low et al.
patent: 5893724 (1999-04-01), Chakravorty et al.

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