Moldable poly(arylene ether) thermosetting compositions,...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C525S065000, C525S066000, C525S09200D, C525S09200D, C525S068000, C525S133000

Reexamination Certificate

active

07022777

ABSTRACT:
A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an easily dissolved solid concentrate with the thermosetting resin.

REFERENCES:
patent: 3306875 (1967-02-01), Hay
patent: 4054553 (1977-10-01), Olander
patent: 4092294 (1978-05-01), Bennett, Jr. et al.
patent: 4436870 (1984-03-01), Hinselmann et al.
patent: 4477649 (1984-10-01), Mobley
patent: 4477651 (1984-10-01), White et al.
patent: 4496695 (1985-01-01), Sugio et al.
patent: 4517341 (1985-05-01), White
patent: 4565684 (1986-01-01), Tibbetts et al.
patent: 4572813 (1986-02-01), Arakawa
patent: 4594371 (1986-06-01), Nauman
patent: 4623558 (1986-11-01), Lin
patent: 4663230 (1987-05-01), Tennent
patent: 4816289 (1989-03-01), Komatsu et al.
patent: 4853423 (1989-08-01), Walles et al.
patent: 4876078 (1989-10-01), Arakawa et al.
patent: 4888397 (1989-12-01), van der Meer et al.
patent: 4912172 (1990-03-01), Hallgren et al.
patent: 4954195 (1990-09-01), Turpin
patent: 5017663 (1991-05-01), Mizuno et al.
patent: 5024818 (1991-06-01), Tibbetts et al.
patent: 5043367 (1991-08-01), Hallgren et al.
patent: 5089343 (1992-02-01), Colborn et al.
patent: 5098781 (1992-03-01), Minnik et al.
patent: 5162450 (1992-11-01), Chao et al.
patent: 5165909 (1992-11-01), Tennent et al.
patent: 5212239 (1993-05-01), Mallikarjun
patent: 5213886 (1993-05-01), Chao et al.
patent: 5294655 (1994-03-01), Lee et al.
patent: 5308565 (1994-05-01), Weber et al.
patent: 5352745 (1994-10-01), Katayose et al.
patent: 5397822 (1995-03-01), Lee, Jr.
patent: 5589152 (1996-12-01), Tennent et al.
patent: 5591382 (1997-01-01), Nahass et al.
patent: 5834565 (1998-11-01), Tracy et al.
patent: 5973144 (1999-10-01), Ishida
patent: 6194495 (2001-02-01), Yeager et al.
patent: 6197898 (2001-03-01), van den Berg et al.
patent: 6518362 (2003-02-01), Clough et al.
patent: 0436212 (1991-10-01), None
patent: 0537005 (1993-04-01), None
patent: 0557086 (1993-08-01), None
patent: 1167484 (2002-02-01), None
patent: WO 01/25358 (2001-04-01), None
Venderbosch R W et al: “Processing of Intractable Polymers Using Reactive Solvents: 2. Poly(2,6-Dimethyl-1,4-Phenylene Ether) as a Matrix Material for High Performance Compositions” Polymer, Elsevier Science Publishers B.V, GB, vol. 36, No. 6, Mar. 1, 1995, pp. 1167-1168, XP000517914 ISSN: 0032-3861 p. 1168.
Pearson R A et al: “The Preparation and Morphology of Pro-Epoxy Blends” Journal of Applied Polymer Science, John Wiley and Sons Inc. New York, US, vol. 48, No. 6, May 10, 1993, pp. 1051-1060, XP000462304 ISSN: 0021-8995, p. 1053.
International Search Report, International Application No. PCT/US 02/13996, Date of Mailing Sep. 24, 2002, International Filing Date Jan. 5, 2002.
International Search Report, International Application No. PCT/US 02/ 13996, International Filing Date Jan. 5, 2002, Date of Malling Apr. 2, 2003.
U.S. Appl. No. 11/031,399, filed Jan. 7, 2005, Michael John Davis.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Moldable poly(arylene ether) thermosetting compositions,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Moldable poly(arylene ether) thermosetting compositions,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Moldable poly(arylene ether) thermosetting compositions,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3620227

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.