Mold-type semiconductor device

Details Mold-type semiconductor device Mold-type semiconductor device

1990-08-24

1993-06-08

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

257727, 257723, H01L 2348, H01L 2350

Patent

active

052182312

ABSTRACT:
A semiconductor device comprises a semiconductor element having a PN junction, a first connector having a first connection surface rising in an embossing manner, connected to a first surface of the semiconductor element via a solder layer at the first connection surface, a second connector having a second connection surface rising in an embossing manner, connected to a second surface of the semiconductor element via a solder layer at the second connection surface.

REFERENCES:
patent: 3995310 (1976-11-01), Koenig
patent: 4500907 (1985-02-01), Takigami et al.
patent: 4607277 (1986-08-01), Hassan et al.
patent: 4724474 (1988-02-01), Duchek et al.
patent: 4768075 (1988-08-01), Broich et al.
patent: 4935803 (1990-06-01), Kalfus et al.

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