Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1993-02-10
1994-09-20
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
249105, 249110, H01L 2328, B22D 4108
Patent
active
053491360
ABSTRACT:
A mold tool for forming an electronic component having a semiconductor chip sealed on a supporting member by a resin-molded package, includes an upper mold having an upper cavity and a lower mold having a lower cavity, the package being molded in the cavities. Upper and lower gates are arranged at opposing surfaces of the molds and symmetrically formed with respect to a parting face of the mold tool to connect with the cavities. A method for forming the component includes the steps of inserting the supporting member with the chip in the cavities of the molds of the mold tool, clamping the molds, injecting molten resin into the cavities of the clamped molds through the upper and lower gates, cooling the molten resin in the cavities, and separating the molds from each other and removing the component from the cavities. The supporting member has a recess where the chip is located, and the recess has such a depth that a distance between an upper surface of the chip located in the recess and an upper surface of the package is substantially equal to a distance between a lower surface of a portion where the recess is formed and a lower surface of the package. A lead frame is one of the supporting member and includes a cutout formed at a portion corresponding to the gates, which are connected to each other through the cutout.
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Abe Mitsuhiro
Hideho Ariyoshi
Iguchi Asao
Itsuto Nakanishi
Ledynh Bot
Matsushita Electric - Industrial Co., Ltd.
Picard Leo P.
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