Mold-thickness adjusting apparatus in mold clamping mechanism

Details Mold-thickness adjusting apparatus in mold clamping mechanism Mold-thickness adjusting apparatus in mold clamping mechanism

1985-12-23

1987-02-24

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Control means responsive to or actuated by means sensing or...

Mold motion or position control

425171, 425589, 425595, B29C 4580

Patent

active

046454438

ABSTRACT:
The present invention provides a mold-thickness adjusting apparatus in a clamping mechanism for molding synthetic resins in which a clamping plate is inserted into and mounted on a plurality of tie bars provided over a pair of fixed plates on a machine bed, wherein despite the mold-thickness adjustment is effected by a connecting portion between a clamping ram and a clamping plate, a positional movement of the clamping plate resulting from rotation can be done smoothly, and even if mutual threads are temporarily brought into close contact with each other due to the concentration of the clamping force on the connecting portion, members can be rotated after the close contact has been relieved.

REFERENCES:
patent: 3656877 (1972-04-01), Aoki
patent: 4321026 (1982-03-01), Lambertus

Affiliated with

Also associated with

Rating

Mold-thickness adjusting apparatus in mold clamping mechanism does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold-thickness adjusting apparatus in mold clamping mechanism, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold-thickness adjusting apparatus in mold clamping mechanism will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-106827